In a world rapidly shifting toward intelligent systems and data-driven decisions, the demand for smaller, more accurate, and highly responsive smart sensors has never been higher. From automotive safety systems and industrial IoT platforms to medical diagnostics and environmental monitoring, the sensor revolution is well underway. But behind every smart sensor lies a foundation of ultra-precise, high-performance components—and the Micro Component Group (formerly micrometal Group, and comprising micrometal Gmbh, HP Etch, Etchform, and Thin Metal Parts Inc.), is leading the charge to manufacture them.
At the heart of this movement is photo-chemical etching (PCE), a process uniquely suited to the production of thin, complex metal components that define the performance envelope of today’s sensor technology. By offering stress-free, burr-free, and micron-accurate parts, Micro Component Group is enabling OEMs to develop smarter, faster, and more compact sensors, without compromise.
“Sensors are only as good as the components that make them work,” says Jochen Kern, Head of Sales and Marketing at the Micro Component Group. “With PCE, we’re unlocking geometries and tolerances that traditional machining simply can’t deliver. This is what’s pushing the boundaries of sensor accuracy and responsiveness.”
What sets the Micro Component Group apart is its ability to achieve intricate designs and ultra-thin profiles on materials such as stainless steel, copper, and titanium with unmatched repeatability. Whether it’s an ultra-fine mesh for gas detection, a micro-structured diaphragm in a pressure sensor, or a flexible contact in a wearable health monitor, PCE makes it possible, with no mechanical stress, heat distortion, or costly tooling.
And in today’s volatile supply chain environment, the Micro Component Group’s agile, tooling-free process is more relevant than ever. Rapid prototyping, fast design iterations, and scalable production are not luxuries, they’re survival tools.
“We’re not just providing components. We’re providing design freedom, speed to market, and reliability for the most critical sensor applications,” adds Kern. “PCE is no longer a niche process, it’s an essential manufacturing method for next-gen technology.”
As industries race to embed intelligence into all kinds of applications, the Micro Component Group is helping ensure the hardware can keep up. With its deep expertise in PCE and a growing global presence, the Group continues to shape the future of precision manufacturing, one etched sensor component at a time.
